Wood Stabiliser

Winsir High-Strength White Emulsion Adhesive achieves semiconductor-grade purity. Sodium, potassium, and iron ions are all below 1 ppm. This meets SEMI C7-0308 standards. A semiconductor materials company in Shenzhen uses this high-strength white emulsion adhesive as a film-forming resin for photoresists. Their customers include major wafer fabs in China. This product can also serve high-end woodworking applications. But its primary value lies in precision electronics manufacturing. It is a testament to Winsir's advanced purification capabilities.

Winsir High-Strength White Emulsion Adhesive uses a soap-free emulsion polymerization process. We do not use traditional emulsifiers. Instead, we use polymerizable surfactants to reduce small molecule residues. The polymerization kettle is made of 316L stainless steel with an electropolished inner wall. We use online particle size detectors for quality control. The solid content is 45% ± 1%. The pH value is between 7.0 and 8.0. At 25°C, the viscosity is 1,500 to 2,500 centipoise. This high-strength white emulsion adhesive is filtered through a 0.2-micron absolute precision filter. Particles larger than 0.2 microns are fewer than 100 per milliliter.

Winsir High-Strength White Emulsion Adhesive delivers ultra-high purity. ICP-MS testing confirms all metal ions are below 0.5 ppm. This ensures no interference with photosensitizer reactivity. For particle size uniformity, dynamic light scattering shows a PDI of less than 0.08. This forms a nano-level smooth film that reduces scattering defects. For thermal stability, after baking at 150°C for 30 minutes, the film shows a color difference (ΔE) of less than 1.0. Thermogravimetric analysis shows the decomposition temperature is above 300°C. Every batch of this high-strength white emulsion adhesive undergoes metal ion testing and particle counting.