Rubberwood Anti-Rot and Anti-Blue Stain Agent

Ordinary white glue cannot be used for chip manufacturing. But Winsir High-Strength White Emulsion Adhesive is specially purified. Its metal ion content is extremely low. Sodium, potassium, and iron are all below 1 ppm per SEMI C7-0308 standards. This makes it suitable as a raw material for photoresists. A semiconductor materials company in Shenzhen uses our high-strength white emulsion adhesive as a film-forming resin. Their customers include major Chinese wafer fabs. This product can also be used for high-end woodworking. But it holds even greater value for the precision electronics industry.

Winsir High-Strength White Emulsion Adhesive uses a soap-free emulsion polymerization process. We do not use traditional emulsifiers. Instead, we use polymerizable surfactants. This fundamentally reduces small molecule residues. The polymerization kettle is made of 316L stainless steel. The inner wall is electropolished. We have online particle size detectors. The solid content is 45% ± 1%. The pH value is between 7.0 and 8.0. At 25°C, the viscosity is 1,500 to 2,500 centipoise. This high-strength white emulsion adhesive is filtered through a 0.2-micron absolute precision filter. Particles larger than 0.2 microns are fewer than 100 per milliliter.

Winsir High-Strength White Emulsion Adhesive offers ultra-high purity. ICP-MS testing shows all metal ions below 0.5 ppm. This does not affect the reactivity of photosensitizers. For particle size uniformity, dynamic light scattering shows a PDI of less than 0.08. After coating, it forms a nano-level smooth film. This reduces scattering defects during photolithography. For thermal stability, after baking at 150°C for 30 minutes, the film color difference (ΔE) is less than 1.0. Thermogravimetric analysis shows a decomposition temperature above 300°C.